New LNP Thermocomp grade is designed to improve the process and economics of LDS in small parts like this GPS tracker. Courtesy of SABIC
Resin producer SABIC is the latest to commercialize a formulation based on engineering resins for use in laser direct structuring (LDS) of antennas in electronics.
LNP Thermocomp WF006V is a 30 percent glass-reinforced compound of polybutylene terephthalate and polycarbonate. Properties include signal gain, high tensile modulus which improves molding of small, thinwall parts and good surface quality for enhanced product aesthetics.
LDS is a precise and environmentally friendly way of integrating antennas in three-dimensional molded interconnect devices, as well as the housings and covers of consumer electronics. The technology replaces flexible printed circuit antennas.
The process allows an antenna design to be directly transferred onto the three-dimensional surface of a part molded from a polymer containing special additive chemistry. After laser activation of the pattern and chemical plating, the antenna is connected to a circuit. The process achieves part integration, minimizes space requirements, simplifies prototyping and enables cost-effective mass production, SABIC states.
Key properties of the compound include dielectric stability, high levels of impact resistance and chemical resistance, low warp and low moisture uptake. SABIC states the compound is formulated to avoid rework and yield loss during production and so maintain target manufacturing costs and manufacturing schedules.
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